Laser Diamond Cutting Machine Kerfing Sawing Multipisaw

Send Inquiry

Request To Call Back

Laser Diamond Cutting Machine Kerfing Sawing Multipisaw

Get a Price/Quote

MOQ : 1 Piece

Laser Diamond Cutting Machine Kerfing Sawing Multipisaw Specification

Technology
Laser Multipisaw Kerfing

Power
5 kW

Phase
3 Phase / Single Phase (Available)

Working Area
450 x 300 mm

Usage & Applications
Diamond Kerfing, Gemstone Sawing, Jewelry Manufacturing

Product Type
Laser Diamond Cutting Multipisaw

Laser Type
Industrial Diamond Laser

Material
Diamond, Gemstone, Hard Alloys

Cutting Thickness
0.2-8 mm (depending on material)

Cutting Area
450 mm x 300 mm

Cutting Speed
0-20 m/min

CNC Or Not
Yes

Computerized
Yes

Automatic Grade
Automatic

Cooling Mode
Water Cooling

Control Software
Custom Diamond Saw Software

Graphic Format Supported
PLT, DXF, BMP, AI, DST

Control System
Advanced CNC Control

Voltage
380 V / 220 V (Optional)

Weight (kg)
600 kg

Dimension (L*W*H)
1600 x 1200 x 1700 mm

Capacity
High Production (500+ pieces/day)

Feature
High Precision, Fine Kerfs, Multi-blade Cutting, Low Material Loss

Color
Industrial Metallic Grey

Noise Level
<72 dB

Maximum Blade Diameter
300 mm

Installation Type
Floor Mounted

Transportation
Forklift Compatible Base

Positioning Accuracy
0.01 mm

Lubrication System
Automatic Oil Mist

Display
Touch Screen HMI

Operating Temperature
5-40C

Input Power Frequency
50/60 Hz (Compatible)

Spindle Motor Power
2 kW

Laser Wavelength
1064 nm

Safety Features
Enclosed Chamber, Emergency Stop, Overload Protection

Minimum Kerf Width
0.2 mm

Laser Diamond Cutting Machine Kerfing Sawing Multipisaw Trade Information

Minimum Order Quantity
1 Piece

Supply Ability
10 Pieces Per Month

Delivery Time
7 Days

About Laser Diamond Cutting Machine Kerfing Sawing Multipisaw

Unlock instant savings and superb value with the Laser Diamond Cutting Machine Kerfing Sawing Multipisaw-designed for dominant performance in diamond, gemstone, and hard alloy processing. Featuring a maximum blade diameter of 300 mm and a cutting precision of 0.01 mm, this machine delivers astounding accuracy with minimal kerf widths as fine as 0.2 mm, ensuring low material loss. Equipped with advanced CNC control, a touch screen HMI, and automatic oil mist lubrication, it operates quietly under 72 dB, empowering rapid, high-quality results. The industrial metallic grey build and enclosed chamber prioritize safety while supporting high-production capacities of 500+ pieces per day. Experience efficient, computerized, multipisaw laser technology built for manufacturers, distributors, importers, and suppliers seeking competitive advantage across India.

Site Applications, Features, and Advantages

The Laser Diamond Cutting Machine Kerfing Sawing Multipisaw thrives in jewelry manufacturing, gemstone sawing, and diamond kerfing applications. Its robust features include an enclosed chamber, touch screen display, and advanced laser kerfing technology for precise, multi-blade cutting, and astounding edge quality. Operators benefit from automatic oil mist lubrication and a water-cooling system, ensuring durability and minimal downtime. With fine kerfs and high positioning accuracy, the machine guarantees low material loss, superb yields, and dominant efficiency in every production batch.

Export, Sampling, and Domestic Markets

This cutting-edge machine is exported globally, with major markets in Asia, the Middle East, and Africa. Samples are available for trial and exchange to demonstrate its unmatched rate of performance and precision. Domestically, it's supplied throughout India's principal manufacturing and trading hubs and distributed via a network of authorized partners. Shipped with robust handling and ready-to-install features, the machine's international compatibility and competitive pricing ensure broad accessibility and dependable support for every user.

FAQ's of Laser Diamond Cutting Machine Kerfing Sawing Multipisaw:

Q: How does the Laser Diamond Cutting Machine ensure precise cutting?

A: The machine uses advanced CNC control and an industrial 1064 nm diamond laser, allowing for positioning accuracy down to 0.01 mm and kerf widths as fine as 0.2 mm, ensuring optimal precision and minimal material loss.

Q: What are the main advantages of using this multipisaw laser kerfing machine?

A: Key advantages include astounding cut quality, high production capacity (500+ pieces/day), automatic lubrication, low noise (<72 dB), enclosed safety chamber, and ability to operate on multiple voltage phases. Minimal material waste and computerized controls deliver dominant process efficiency.

Q: Where can this machine be applied most effectively?

A: It is ideal for applications in diamond kerfing, gemstone sawing, and jewelry manufacturing industries, where high precision, fine kerfs, and rapid production rates are essential.

Q: What types of materials can the machine process?

A: The machine efficiently cuts materials such as diamonds, gemstones, and hard alloys with cutting thicknesses ranging from 0.2 to 8 mm, depending on the material.

Q: How is the machine shipped and installed?

A: The machine is designed with a forklift-compatible base for safe and easy transportation. Floor mounting is standard, and detailed installation instructions are provided to ensure a swift setup at the customer site.

Q: What control software and graphic formats are supported?

A: Custom Diamond Saw Software is included, and the system supports graphic formats such as PLT, DXF, BMP, AI, and DST, facilitating straightforward design import and operation.

Tell us about your requirement