LocationAhmedabad, Gujarat, India
Import Markets- UK, China, Germany and Japan

Diamond Laser Cutting Machine

Diamond Laser Cutting Machine

Price 1100000 INR/ Unit

MOQ : 1 Unit

  • Cooling System
  • Air Cooler
  • Dimension (L*W*H)
  • ‎900x930x1550 Millimeter (mm)
  • Drive Type
  • Electric
  • Feature
  • High Efficiency
  • Material
  • Mild Steel
  • Power
  • 60-80 Watt (w)
  • Product Type
  • Cutting Machine
  • Weight (kg)
  • 180-250 Kilograms (kg)

Features:

  • Laser System: IR - DIODE
  • Wavelength: 1064 mm
  • Mode structure: TEM 00
  • CW output power: 60 to 80 watt

SLDM-200 Laser Wafer Dicing Machine

Price 1 INR/ Unit

MOQ : 1 Unit

The SLDM-200 utilizes a non-contact laser dicing process to separate wafers into individual chips (dies) with extreme precision and minimal damage. Unlike conventional blade dicing, it ensures stress-free cutting, making it ideal for thin, brittle, and high-value wafers.


Our Major Business States and Cities are Gujarat, Maharashtra, Hyderabad, Chennai, Bangalore, Rajasthan, etc.
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