LocationAhmedabad, Gujarat, India
Import Markets- UK, China, Germany and Japan
SLDM-200 Laser Wafer Dicing Machine
SLDM-200 Laser Wafer Dicing Machine

SLDM-200 Laser Wafer Dicing Machine

Price 1 INR/ Unit

MOQ : 1 Unit
 
 

About SLDM-200 Laser Wafer Dicing Machine

The SLDM-200 utilizes a non contact laser dicing process to separate wafers into individual chips dies with extreme precision and minimal damage. Unlike conventional blade dicing it ensures stress-free cutting, making it ideal for thin, brittle, and high-value wafers.
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Our Major Business States and Cities are Gujarat, Maharashtra, Hyderabad, Chennai, Bangalore, Rajasthan, etc.
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